Features

• Enables high-speed transmission with low loss at the rate of at least 1 Gpbs.           

• Incorporating a coplanar structure, thus ensuring exact impedance  matching.      

• Supple and flexible FPC.           

• ossible to provide applications integrated with high-speed transmission connectors.

Basic structure:

Application:

• Components for high-speed transmission at the rate of at least 1 Gbps

• Movable components of devices, such as car navigation systems and surveillance cameras

• Components that require a high degree of layout freedom

Features:

• Enables high-speed transmission with low loss at the rate of at least 1 Gpbs.

• Possible to make a highly noise-resistant FPC with double layers provided.

• Incorporating a microstrip structure, thus ensuring exact impedance matching.

• Possible to provide applications integrated with high-speed transmission connectors.

  
  

Basic structure:

Application:

• Components for high-speed transmission at the rate of at least 1 Gbps

• Components that need countermeasures against static electricity inside the equipment

• Components that require EMI and MEC countermeasures

Features:

• Enables high-speed transmission with low loss at the rate of at least 1 Gpbs.

• Flexible and excellent bend performance at high temperatures with high reliability.

【Flexing characteristics】

   At least 10 million times at 70°C.

  Evaluation conditions:

  Temperature: 70°C; clearance: 10 mm (R=5); stroke: 80±1 mm, speed: 35 times/minute

Basic structure:

Application:

• High-speed transmission part at the rate of at least 1 Gbps

• Movable components with small bending radius and one million times of operation.

• Components that require a high degree of layout freedom

Features:

• Double-sided FPC with low transmission loss in the high frequency ange of the GHz band.

• Insertion loss measured: -4.7 dB @5 GHz (provided that the product length is 300 mm)

  Using an overlay made from liquid crystal polymer for the achievement of lower loss.

Basic structure:

Application:

• Components that require high-speed and long-distance transmission at the rate of at least 1 Gbps

• Components for which low loss is required by standards, such as SATA

Features:

• High-speed transmission cable with a maximum length of 1,150mm is available.

• Flexible and high-flexion is available.

• Low loss FPC of cable length 1,150mm is possible.

Basic structure:

Application:

• The movable portion of the robot, the gaming machine moving cables, and replacement of automotive wire harness.

• Application seeking a lightweight cable.

• High-speed transmission site of more than Gbps.

• Flexion radius is small, and 1 million times or more movable sites.

Features:

• A multi-layer substrate with excellent high-frequency characteristics.         

• Multi-layer substrate of the world's thinnest class  (10 layers 0.45 mmt).    

• Enabling all-layers random via connections, thus improving  the degree of freedom of designing.    

• Possible to use a bump connection method for board space reduction.

Application:

• High-frequency PCB for ultra-high frequencies at 60 GHz or higher

• Thin PCB with high-frequency characteristics

• Replacement of flex rigid PCBs

• Replacement of Teflon PCBs and ceramic PCBs

Features:

• Adopting PEN as an insulation material, thus making  low-temperature reflow soldering possible.

• A transparent FPC with excellent permeability.

• Forming fine wiring thus making designing to hide wiring possible.

Basic structure:

Application:

• Electric ornament components of game machines

• Electric ornament components of commercial facilities

Features:

• Excellent flexibility and allowing secondary processing, including bending, and the mounting of electronic components.

Basic structure: